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本帖最后由 春眠不觉晓 于 2023-10-25 10:43 编辑
https://www.techinsights.com/blo ... memory-market-first
China Does It Again
A NAND Memory Market First
TechInsights has discovered the world's most advanced 3D NAND memory chip in a consumer device, and in a surprise technology leap, it comes from YMTC – China’s top 3D NAND manufacturer. 3D NAND memory is an essential component for high-performance computing (HPC) such as artificial intelligence (AI) and machine-learning. 3D NAND memory represents the bleeding edge of memory chip design, and is critical for high-performance, high-bandwidth computing such as AI. This is the first quad-level cell (QLC) 3D NAND die with more than two hundred active word lines that TechInsights has seen.
TechInsights 在消费设备中发现了世界上最先进的 3D NAND 存储芯片，令人惊讶的是，它来自中国顶级 3D NAND 制造商长江存储。 3D NAND 存储器是人工智能 (AI) 和机器学习等高性能计算 (HPC) 的重要组件。 3D NAND 存储器代表了存储芯片设计的前沿，对于人工智能等高性能、高带宽计算至关重要。 这是 TechInsights 见过的首款四级单元 (QLC) 3D NAND 芯片，具有超过 200 个有效字线。
The 232-layer QLC 3D NAND die manufactured by YMTC (Figure 1), was found in the ZhiTai Ti600 1TB solid state drive (SSD) which was launched in July 2023 without much fanfare (Figure 2 and Figure 3). This new QLC die has the highest bit density seen in a commercially available NAND product at 19.8 Gb/mm2.
Key takeaways from this discovery include:
- YMTC proved again the merits of the Xtacking Hybrid Bonding technology they developed for 3D NAND TLC and QLC applications. BSSC technology adopted for Xtacking3.0 232L realized yield and performance improvements, and cost reduction as well.
- YMTC is quietly developing advanced technology despite being hampered by issues following sanctions including limiting the company from supplying parts to Apple for China-based iPhones and being placed on the United States’ entity list.
- The recent memory downturn, as well as many memory manufacturers focused on cost saving measures, may have provided YMTC an opportunity to pull ahead with its higher bit density 3D Xtacking NAND.
- This discovery usurps Micron and Intel (Solidigm) who are also developing 232-layer QLC 3D NAND devices. It should be noted that Samsung is not developing QLC on its 236-layer (V8) 3D NAND because its current strategy is to focus on the V9 3D NAND TLC and QLC. However, at Samsung’s Memory Tech Day last week, the company announced the first QLC product targeting the mobile market, a 512GB UFS 3.1 product with 176-layers (V7) technology. SK Hynix is mostly focused on TLC devices rather than QLC products.
- Like the innovation revealed by TechInsights in the Huawei Mate 60 Pro’s HiSilicon Kirin 9000s processor (which used SMIC 7nm (N+2) process) evidence is mounting that China’s momentum to overcome trade restrictions and build its own domestic semiconductor supply chain is more successful than expected.
长江存储制造的 232 层 QLC 3D NAND 芯片（图 1）出现在 2023 年 7 月推出的致钛 Ti600 1TB 固态硬盘（SSD）中（图 2 和图 3）。 这款新型 QLC 芯片具有市售 NAND 产品中最高的位密度，为 19.8 Gb/mm2。
这一发现的主要结论包括：
—— 长江存储再次证明了他们为3D NAND TLC和QLC应用开发的Xtacking Hybrid Bonding技术的优点。 Xtacking3.0 232L采用的BSSC技术实现了产量和性能的提高，并降低了成本。
—— 尽管受到制裁后问题的阻碍，包括限制该公司向苹果供应中国 iPhone 的零部件以及被列入美国实体名单，长江存储仍在悄悄开发先进技术。
—— 最近的内存低迷以及许多内存制造商专注于节省成本的措施，可能为长江存储提供了一个机会来推进其更高位密度的 3D Xtacking NAND。
—— 这一发现取代了同样在开发 232 层 QLC 3D NAND 设备的美光和英特尔 (Solidigm)。 需要注意的是，三星并未在其236层（V8）3D NAND上开发QLC，因为其目前的策略是专注于V9 3D NAND TLC和QLC。 然而，在三星上周的内存技术日上，该公司宣布了首款针对移动市场的 QLC 产品，即采用 176 层（V7）技术的 512GB UFS 3.1 产品。 SK海力士主要专注于TLC器件而不是QLC产品。
—— 就像 TechInsights 在华为 Mate 60 Pro 的海思麒麟 9000s 处理器（采用中芯国际 7nm (N+2) 工艺）中所揭示的创新一样，越来越多的证据表明，中国克服贸易限制和建立自己的国内半导体供应链的势头比中国更成功。 预期的。
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发表于 2023-10-25 10:41
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